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IPC APEX Expo 2013

 
Type:
Conference & Exhibition  
Date:
16 Feb 2013 - 21 Feb 2013  
Location:
San Diego, CA  

Conference: Feb. 16 - 21
Exhibition: Feb. 19 – 21

The IPC APEX Expo is the largest exhibition and event for electronics assembly in North America, attracting nearly 9,000 visitors each year from more than 50 countries. The conference features advanced and emerging technologies in PCB design, manufacturing, assembly, and test.

A group of PCB design and supply companies formed the IPC-2581 Consortium in mid-2011 to enable and drive adoption of the IPC-2581 standard throughout the industry. At the APEX Expo 2013, the Consortium will continue to promote IPC-2581 as an open, neutral, global standard for efficient design data transfer.

IPC-2581 Consortium Booth #2439
See the progress made since the APEX show last year. IPC-2581 data will be output from Allegro (16.6) and then consumed by tools from ADIVA, Downstream Technologies, and WISE Software for DFM checking, viewing, and documentation.

You will also see the industry’s first PCB fabricated by transferring the design data to manufacturing in the IPC-2581 format. Find out how CC Electronics, the board manufacturer, shortened design time by 30% using IPC-2581 instead of traditional, multiple file formats to describe the PCB design.

Speak directly with Consortium members representing system, EDA, DFM software, and manufacturing companies to learn why it’s worth the effort to support this global neutral standard.

IPC-2581 Presentations

Monday, Feb. 18, 8:00am – 8:30am
Roadmapping for Design
Speaker: Dieter Bergman, IPC Director of Technology Transfer, IPC

Monday, Feb. 18, 8:30am – 9:15am
Efficient Design Data Transfer to Manufacturing Using IPC-2581
Speaker: Ed Acheson, Principal Product Engineer, Cadence

IPC Standards Development Committee Meetings
Monday, Feb. 18, 1:30pm – 3:00pm
Test Coupon and Artwork Generation Task Group (1-10C)
Speakers: Timothy Estes, Chairman, Conductor Analysis Technologies and Phillip Henault, Vice Chairman, Raytheon Company

Monday, Feb. 18, 1:30pm – 5:00pm
Product Data Description (Laminar View) Subcommittee (2-16)
Presenters/Chairs: Karen McConnell CID, Chairman, Northrop Grumman Corporation

Tuesday, Feb. 19, 10:00am – 12:00pm
Electronic Documentation Technology Committee (2-40)
Presenters/Chairs: Karen McConnell CID, Chairman, Northrop Grumman Corporation

Tuesday, Feb. 19, 1:30pm – 5:00pm
Embedded Devices Process Implementation Subcommittee (D-55)
Speakers: Rajesh Kumar, Co-Chairman, Viasystems North America and Vern Solberg, Co-Chairman, Invensas Corporation

Tuesday, Feb. 19, 1:30pm – 5:00pm
IPC-2221/2222 Task Group (D-31B)
Speakers: Gary Ferrari CID+, CIT, Chairman, FTG Circuits and Clifford Maddox, Vice Chairman, Boeing Company

Cadence and the IPC-2581 Consortium
As a founding member of the IPC-2581 Consortium, Cadence believes it is in the industry’s best interest that an open, public, neutrally maintained standard be adopted by all segments of the PCB design, fabrication, assembly, and test supply-chain.

Cadence is committed to developing and maintaining IPC-2581 export from our Allegro PCB design software and staying current with the latest approved and published IPC-2581 specifications. We also collaborate with all Consortium members to ensure that Allegro-derived IPC-2581 data can be accurately and smoothly consumed by their technologies, methodologies, and processes.

Learn more about Cadence and the IPC-2581 Consortium.

Who should attend?
PCB designers, engineers, fabricators, and assemblers

Further information

Questions About this Event?
Send email to events@cadence.com