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Digital Implementation
Optimizing logical, physical, electrical, and manufacturing effects
Cadence digital implementation technology eliminates iteration without sacrificing design quality by addressing timing sensitivity, yield variation, and leakage power from the start.
Design planning
To create a design layout that fulfills the often conflicting objectives of performance, power, and cost, engineers must perform comprehensive physical design space exploration and feasibility analysis up-front. Cadence
®
technology allows designers to implement a silicon virtual prototyping methodology to perform the planning and analysis that ensures a smooth hand-off to the physical implementation flow. It also includes the latest low-power design and yield enhancement capabilities to support advanced 65nm design.
First Encounter Silicon Virtual Prototyping
Helps designers create more accurate block-level constraints, get an early picture of top-level timing, congestion, and power problems, and make more intelligent selections of IP and packages to reduce iterations.
Learn more
»
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
Hierarchical design
Achieving rapid design convergence in large, complex chips requires greater capacity, accuracy, and automation than that provided by conventionally rigid hierarchical design flows. With innovative and flexible Cadence
®
technology, designers can eliminate iterations and achieve timing closure quickly. They can also leverage advanced interface logic modeling, multi-mode/multi-corner design, and virtual partitioning to increase both productivity and accuracy.
First Encounter Silicon Virtual Prototyping
Helps designers create more accurate block-level constraints, get an early picture of top-level timing, congestion, and power problems, and make more intelligent selections of IP and packages to reduce iterations.
Learn more
»
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
NanoRoute Router
Optimizes routing for signal integrity, timing, and DFM while still maintaining the utmost in speed and capacity. Shifts DFM awareness into the implementation phase, where engineers can maximize changes at minimal cost.
Learn more
»
Block implementation
During place-and-route of design blocks, excessive guard-banding can increase both area and power consumption and degrade design performance. Cadence
®
block implementation technology offers process-aware analysis to detect adverse effects on yield and reliability, such as manufacturing process variations, lithography, chemical mechanical polishing (CMP), and random defects. Using foundry-correlated statistical and manufacturing models, it honors original design intents, preserves logical correctness, and delivers the ease-of-use, capacity, and performance to support advanced nodes down to 45nm.
First Encounter Silicon Virtual Prototyping
Helps designers create more accurate block-level constraints, get an early picture of top-level timing, congestion, and power problems, and make more intelligent selections of IP and packages to reduce iterations.
Learn more
»
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
NanoRoute Router
Optimizes routing for signal integrity, timing, and DFM while still maintaining the utmost in speed and capacity. Shifts DFM awareness into the implementation phase, where engineers can maximize changes at minimal cost.
Learn more
»
Low-power implementation
Today’s devices dissipate as much power at idle as while running—but incorporating advanced techniques to meet stringent power objectives can introduce risk. Cadence
®
low-power implementation technology makes it easy to adopt power reduction methods such power shut-off (PSO), multiple supply voltages (MSV), dynamic voltage and frequency scaling (DVFS), and substrate biasing. It also analyzes the effects of multiple threshold voltages and clock gating, and leverages the Common Power Format (CPF) to provide an integrated flow.
First Encounter Silicon Virtual Prototyping
Helps designers create more accurate block-level constraints, get an early picture of top-level timing, congestion, and power problems, and make more intelligent selections of IP and packages to reduce iterations.
Learn more
»
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
Encounter Timing System
Serves both front-end logic designers looking for high-quality static timing analysis and ease of use, as well as back-end implementation engineers requiring electrical analysis and a common timing engine for silicon-accurate signoff.
Learn more
»
Encounter Power System
Cadence® Encounter® Power System provides consistent, converging power and power rail integrity analysis across the design and implementation flow—spanning floor/power planning, physical implementation, optimization, and signoff. It not only helps front-end logic designers seeking high-quality early power and rail analysis with ease of use but also back-end physical designers looking for comprehensive signoff analysis and silicon-correlation.
Learn more
»
Cadence Low-Power Methodology Kit
Streamlines the adoption of low-power techniques and optimizes their usage. Eliminates risk with a complete front-to-back methodology, best practices, checklists, and reference flows.
Learn more
»
Advanced node design
Faster production of digital system-on-chip (SoC) designs at 65nm nodes and below requires capabilities that go beyond the conventional rule-based approach. Designers also need to accurately model critical parametric variation in the manufacturing process, such as lithographic effects, chemical-mechanical polishing (CMP), and random defect probability. Cadence® digital implementation technology incorporates both rule- and model-based DFM/DFY analysis that correlates with foundry process simulation for fast and accurate signoff. With concurrent yield loss prevention, risk analysis, and a manufacturability optimization methodology, designers can address many manufacturability considerations in the early stages of the design flow, so what they design is what they get in silicon.
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
NanoRoute Router
Optimizes routing for signal integrity, timing, and DFM while still maintaining the utmost in speed and capacity. Shifts DFM awareness into the implementation phase, where engineers can maximize changes at minimal cost.
Learn more
»
Encounter Timing System
Serves both front-end logic designers looking for high-quality static timing analysis and ease of use, as well as back-end implementation engineers requiring electrical analysis and a common timing engine for silicon-accurate signoff.
Learn more
»
Mixed-signal design
Physical implementation of mixed-signal designs is becoming increasingly difficult. As more analog functionality and larger digital logic are integrated into the same die, data management can be a critical factor in enabling practical and efficient design implementation methodologies. From floorplanning through physical assembly, increasing design size demands higher levels of automation, while sensitive circuitry continues to enforce the need for custom design approaches. Cadence® mixed-signal design technology offers a combination of advanced design solutions and methodologies that increase design efficiency.
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
Virtuoso Digital Implementation
Provides a complete synthesis/place-and-route system for small digital block implementation in the context of a schematic-driven, mixed-signal design methodology.
Learn more
»
Design closure
Increases in complexity and scale for today's digital designs have created new challenges in design exploration and timing closure for different modes and corners, and also in overall runtime and performance. Designers require an effective solution for implementing hierarchical as well as flat design styles. Cadence® digital implementation technology offers a full-featured netlist-to-GDSII solution for design exploration and implementation of both flat and hierarchical designs. Using its advanced design closure and end-to-end multi-CPU capabilities, designers can optimize the use of existing hardware, minimize turnaround times for design closure, and maximize the quality of results.
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
Signoff analysis
Successful digital chip design hinges on accurate and consistent signoff analysis. Cadence
®
signoff analysis technology brings together logical, physical, electrical, and manufacturing domain requirements in a single, easy-to-use environment, enabling front-end to back-end design handoff, signoff-driven implementation, and final signoff. It analyzes timing, signal integrity, power consumption, statistical static timing, electro-migration, and thermal characteristics using effective current source models (ECSMs). With multi-dimensional root-cause analysis, designers can shave weeks off tapeout schedules and prevent silicon failures.
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
Encounter Timing System
Serves both front-end logic designers looking for high-quality static timing analysis and ease of use, as well as back-end implementation engineers requiring electrical analysis and a common timing engine for silicon-accurate signoff.
Learn more
»
Encounter Power System
Cadence® Encounter® Power System provides consistent, converging power and power rail integrity analysis across the design and implementation flow—spanning floor/power planning, physical implementation, optimization, and signoff. It not only helps front-end logic designers seeking high-quality early power and rail analysis with ease of use but also back-end physical designers looking for comprehensive signoff analysis and silicon-correlation.
Learn more
»
Cadence QRC Extraction
Extracts and analyzes full-chip parasitics quickly and accurately. Accelerates timing closure and delivers higher quality of silicon.
Learn more
»
Encounter Library Characterizer
Automatically generates the latest library modeling formats. Accelerates characterization and re-characterization.
Learn more
»
Cadence Low-Power Methodology Kit
Streamlines the adoption of low-power techniques and optimizes their usage. Eliminates risk with a complete front-to-back methodology, best practices, checklists, and reference flows.
Learn more
»
Cadence QRC Extraction
Extracts and analyzes full-chip parasitics quickly and accurately. Accelerates timing closure and delivers higher quality of silicon.
Learn more
»
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
Encounter Library Characterizer
Automatically generates the latest library modeling formats. Accelerates characterization and re-characterization.
Learn more
»
Encounter Power System
Cadence® Encounter® Power System provides consistent, converging power and power rail integrity analysis across the design and implementation flow—spanning floor/power planning, physical implementation, optimization, and signoff. It not only helps front-end logic designers seeking high-quality early power and rail analysis with ease of use but also back-end physical designers looking for comprehensive signoff analysis and silicon-correlation.
Learn more
»
Encounter Timing System
Serves both front-end logic designers looking for high-quality static timing analysis and ease of use, as well as back-end implementation engineers requiring electrical analysis and a common timing engine for silicon-accurate signoff.
Learn more
»
First Encounter Silicon Virtual Prototyping
Helps designers create more accurate block-level constraints, get an early picture of top-level timing, congestion, and power problems, and make more intelligent selections of IP and packages to reduce iterations.
Learn more
»
NanoRoute Router
Optimizes routing for signal integrity, timing, and DFM while still maintaining the utmost in speed and capacity. Shifts DFM awareness into the implementation phase, where engineers can maximize changes at minimal cost.
Learn more
»
SoC Encounter RTL-to-GDSII System
Combines RTL synthesis, silicon virtual prototyping, automated floorplan synthesis, clock network synthesis, design for manufacturability and yield, low-power and mixed-signal design support, and nanometer routing. Allows engineers to synthesize to a flat virtual prototype implementation at the beginning of the design cycle.
Learn more
»
Virtuoso Digital Implementation
Provides a complete synthesis/place-and-route system for small digital block implementation in the context of a schematic-driven, mixed-signal design methodology.
Learn more
»
VoltageStorm Power Verification
Automates the analysis and optimization of de-coupling capacitance size and location. Reduces dynamic IR drop.
Learn more
»
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