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Silicon Signoff and Verification
Parasitic extraction for signoff
As advanced process geometries continue to shrink, parasitic extraction becomes a necessity throughout the design implementation flow and the validation phase all the way to signoff. With Cadence® signoff analysis technology, you get silicon-accurate interconnect parasitic tool to ensure first-pass silicon success.
Cadence QRC Extraction
The industry’s fastest, most accurate 3D full-chip parasitic extractor, delivering in-design and signoff extraction.
Learn more
»
Cadence Chip Optimizer
Uses a 3D space-based approach that models, analyzes, and optimizes layout based on electrical constraints, manufacturing rules, and objectives.
Learn more
»
Timing analysis for signoff
Timing signoff covers the verification steps that designs must pass before tapeout. Cadence® signoff analysis technology delivers timing analysis that is up to 10X faster than competitive offerings, eliminating the signoff bottleneck so you can meet your power, performance, and time-to-market goals.
Cadence Tempus Timing Signoff Solution
Shrinks timing signoff closure and analysis for faster tapeout while producing designs with less pessimism, area, and power consumption. Enables SoC developers to speed timing closure and move chip designs to fabrication quickly.
Learn more
»
Encounter Timing System
Offers silicon-accurate timing signoff and signal integrity analysis that ensures operational chips after tapeout.
Learn more
»
Power signoff
Meeting the demands for low-power SoCs has become increasingly critical for the growing number of power-sensitive applications. Cadence® signoff analysis technology prevents excessive over-design to enable you to exceed your performance, power, and area targets.
Encounter Power System
Enables accurate and high-capacity power analysis, helping designers debug and verify that power and IR drop constraints are met across multimillion-gate designs and multiple die—with significant gains in productivity.
Learn more
»
Virtuoso Power System
Enables custom design teams to efficiently analyze power and signal integrity for all designs implemented using a custom methodology.
Learn more
»
Physical verification
Typically known as design rule checking (DRC) and layout vs. schematic (LVS), physical verification ensures that spatial and other physical rules given by the foundry are followed in a given layout. Cadence® signoff analysis technology provides an integrated, easy-to-use environment to efficiently perform physical verification.
Assura Physical Verification
Performs design rule checking and layout vs. schematic verification to deliver high-yielding custom IP for SoC designs.
Learn more
»
Cadence Physical Verification System
Offers a front-to-back design, implementation, and signoff flow in a single solution. Speeds turnaround of design rule check and layout versus schematic verification.
Learn more
»
Design for manufacturing
Traditional design for manufacturing (DFM) steps are moving into advanced stages of digital and custom chip design. With Cadence® signoff analysis technology, you're equipped to address physical signoff and electrical variability optimization as part of your DFM flow.
Cadence Litho Physical Analyzer
Detects and corrects lithography hotspots. Uses a model-based technology to predict silicon contours quickly and accurately. Improves parametric yield and chip performance.
Learn more
»
Cadence Litho Electrical Analyzer
Extracts device and interconnect electrical behavior from contours. Detects and repairs timing and leakage hotspots due to systematic variations.
Learn more
»
Cadence CMP Predictor
Enhances design performance and yield through model-based CMP hotspot detection and CMP-aware RC extraction.
Learn more
»
Cadence QuickView Layout and Manufacturing Data Viewer
Allows engineers to view and superimpose manufacturing data in various industry-standard formats.
Learn more
»
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
TSMC and Cadence DFM Services Collaboration
Cadence and TSMC collaborate to deliver best-in-class design-for-manufacturing (DFM) services, which include model-based simulation of LPC and CMP verification for designs at 40nm down to 28nm.
Learn more
»
Computational lithography
With the increasing gap between the capabilities of available lithography equipment and the requirements of aggressive device scaling, traditional OPC / RET methodologies are not able to keep up with the stringent computational lithography demands. Cadence® signoff analysis technology enables you to meet requirements for increased accuracy, ease-of-use, and fast mask cycle time.
Cadence Process Proximity Compensation
Third-generation computational lithography solution suite that meets stringent accuracy, short turnaround time (TAT), and flexible ease-of-use requirements for sub-45nm process technologies. Delivers best post-etch CD accuracy and process window on silicon for every critical layer.
Learn more
»
Cadence MaskCompose Reticle and Wafer Synthesis Suite
Automates and optimizes reticle and wafer synthesis to eliminate errors and reduce mask-making cycle times.
Learn more
»
Assura Physical Verification
Performs design rule checking and layout vs. schematic verification to deliver high-yielding custom IP for SoC designs.
Learn more
»
Cadence Chip Optimizer
Uses a 3D space-based approach that models, analyzes, and optimizes layout based on electrical constraints, manufacturing rules, and objectives.
Learn more
»
Cadence CMP Predictor
Enhances design performance and yield through model-based CMP hotspot detection and CMP-aware RC extraction.
Learn more
»
Cadence Litho Electrical Analyzer
Extracts device and interconnect electrical behavior from contours. Detects and repairs timing and leakage hotspots due to systematic variations.
Learn more
»
Cadence Litho Physical Analyzer
Detects and corrects lithography hotspots. Uses a model-based technology to predict silicon contours quickly and accurately. Improves parametric yield and chip performance.
Learn more
»
Cadence MaskCompose Reticle and Wafer Synthesis Suite
Automates and optimizes reticle and wafer synthesis to eliminate errors and reduce mask-making cycle times.
Learn more
»
Cadence Physical Verification System
Offers a front-to-back design, implementation, and signoff flow in a single solution. Speeds turnaround of design rule check and layout versus schematic verification.
Learn more
»
Cadence Process Proximity Compensation
Third-generation computational lithography solution suite that meets stringent accuracy, short turnaround time (TAT), and flexible ease-of-use requirements for sub-45nm process technologies. Delivers best post-etch CD accuracy and process window on silicon for every critical layer.
Learn more
»
Cadence QRC Extraction
The industry’s fastest, most accurate 3D full-chip parasitic extractor, delivering in-design and signoff extraction.
Learn more
»
Cadence QuickView Layout and Manufacturing Data Viewer
Allows engineers to view and superimpose manufacturing data in various industry-standard formats.
Learn more
»
Cadence Tempus Timing Signoff Solution
Shrinks timing signoff closure and analysis for faster tapeout while producing designs with less pessimism, area, and power consumption. Enables SoC developers to speed timing closure and move chip designs to fabrication quickly.
Learn more
»
Encounter Diagnostics
The industry’s most advanced solution for accelerating yield ramp and reducing costs in manufacturing environments. It rapidly analyzes thousands of failures, identifies the source of systematic yield loss, and pinpoints defect location in the netlist and layout.
Learn more
»
Encounter Digital Implementation System
Encounter Digital Implementation System delivers a complete solution for variation- and manufacturing-aware design closure, low power, mixed-signal implementation, and integrated signoff in a single, scalable multi-CPU-enabled design environment for high-capacity, high-performance digital implementation.
Learn more
»
Encounter Power System
Enables accurate and high-capacity power analysis, helping designers debug and verify that power and IR drop constraints are met across multimillion-gate designs and multiple die—with significant gains in productivity.
Learn more
»
Encounter Timing System
Offers silicon-accurate timing signoff and signal integrity analysis that ensures operational chips after tapeout.
Learn more
»
TSMC and Cadence DFM Services Collaboration
Cadence and TSMC collaborate to deliver best-in-class design-for-manufacturing (DFM) services, which include model-based simulation of LPC and CMP verification for designs at 40nm down to 28nm.
Learn more
»
Virtuoso Power System
Enables custom design teams to efficiently analyze power and signal integrity for all designs implemented using a custom methodology.
Learn more
»
Content Query Web Part [2]
Modeling Stress-Induced Variability Optimizes IC Timing Performance White Paper
New White Paper: 20nm Design - How this Advanced Technology Node Will Transform SoCs and EDA
Taming the Challenges of 20nm Custom/Analog Design White Paper
Next-Generation Signoff Analysis Tackles Electrical, Physical, and Manufacturing Challenges White Paper
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