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 IC Packaging and SiP Design 






Physical layout and co-design
SiP and complex IC package design requires seamless integration between chip and package. Cadence® physical layout and co-design technology offers powerful modeling and simulation to enable informed design tradeoffs early.

Allegro Package Designer
Integrates advanced package design with concurrent IC development. Analyzes physical, electrical, and cost tradeoffs early. Optimizes connectivity, routing, and SI using a constraint-driven methodology.
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Cadence 3D Design Viewer
Provides 3D visualization and wirebond design rule checking (DRC) for IC packages. Enables collaborative markups in a solid model viewer to modify wirebond profiles.
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