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Sigrity Technologies 







Overview
High-tech companies developing complex chips, packages, and boards grapple with power and signal integrity issues arising from rapid increases in IC speed and data transmission rates combined with decreases in power supply voltages and denser, smaller geometries. At the same time, higher I/O counts, multiple stacked chips and packages, and greater electrical performance constraints are making IC package physical designs more complex.

Breakthrough Cadence® solutions, based on patented and proprietary Sigrity™ technologies, can help you overcome these challenges. These solutions target complete power delivery system analyses across chips, packages, and boards; system-level signal integrity (SI) analysis, including simultaneous switching noise (SSN) analysis of high-speed signal transmissions; and, advanced physical design for single- and multi-chip packages, state-of-the-art 3D packages, and systems-in-package (SiPs).